ࡱ;  A\pwwwadmin Ba==h\:#8X@"1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1 Arial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)                + ) , *     +    () *8  *  (8/   ()  (  (                  +    +    +  +  +  +     * `*  `  `` f*  f  f` f* *     *       `f* ff* fa* a* * *    (    (              !+   *!  (!/       (       + * *     *  (      (   !+  !  !+  !  ! `NXH600N65L4Q2F2PGZR3 A@@    ;&L<۶Ƶ 9/19/2024 Base PartNXH600N65L4Q2F2Pb-freeOrderable PartNXH600N65L4Q2F2PGTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightCase2,2'-[(1-Methylethylidene)bis[(dibromo-4,1-phenylene)oxymethylene]]bis[oxirane]-4,4'-(1-methylethylidene)bis[2,6-dibromophenol] copolymer 68928-70-1Fiber Glass (SiO2) 65997-17-3Antimony Trioxide (Sb2O3) 1309-64-4PBT 26062-94-2DBCAluminum Trioxide (Al2O3) 1344-28-1 Copper (Cu) 7440-50-8Die Silicon (Si) 7440-21-3Glue2,3-epoxypropyl-trimethoxysilan 2530-83-8 Miscellaneous trade secretSilica Crystalline (SiO2) 14808-60-7PlatingTin (Sn) 7440-31-5Pressfit Terminal Nickel (Ni) 7440-02-0Phosphorus (P) 7723-14-0 Silicone GelHSilica, [(ethenyldimethylsilyl)oxy]- and [(trimethylsilyl)oxy]- modified 68988-89-6 Solder Paste Silver (Ag) 7440-22-4Terminal Holder Iron (Fe) 7439-89-6Wire Bond - Al Aluminum (Al) 7429-90-5TOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areexempted with the RoHS exemption 7(a), 7(c)and 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDFB 3#ra9   '"#  dMbP?_*+%"d,,??U} @} 9 } DT} }  '      [ NNN P \+ // Q fg h ijRmXA ]    S ^ @3333@  T&@ _>  T>@ _>  T@ `?  TK@ ^@@@  TE@ `?   TM@ a G{Gzf@   TY@ ^ @Gzvo@    T$@ _> ! " T$@ `? # $ TT@ a%G(\/@ & 'TY@ ^(@Yu@  T? _> ) *T ףp= ? _>  T(\X@ `? + ,TQ? ^-@@ . /T>@ `? # $TQ@ ^0@U@ 1 2T@ _> & 'T X@ `?  T? ^3@ @ ) *T? _> 4 5T? _>  TGzX@ `? + ,TQ? a6G(\h@ 7 8TY@ b:!RmXA !!UcVcVD^ l,>FFN<<<N<NN<<NN<<<N<N<<N<<<N0 !"#$%& c V!c!V"c"V#c#V$c$V%dIIIWP&e:3/pub/Collateral/BRD8022-D.PDFBg&YYYZjx(  ~  <@j-        %&& Root EntryWorkbook&