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УА УА УА УА УА УА `ЕnNXH50M65L4Q1PTGМыZЁRЁ3 Ё┐БA└@@ё  ўо  ;>№I }e├█╢╣╩╙╞╡ 9/19/2024 Base Part NXH50M65L4Q1Pb-freeOrderable PartNXH50M65L4Q1PTGTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightCaseЙ2,2'-[(1-Methylethylidene)bis[(dibromo-4,1-phenylene)oxymethylene]]bis[oxirane]-4,4'-(1-methylethylidene)bis[2,6-dibromophenol] copolymer 68928-70-1Fiber Glass (SiO2) 65997-17-3Antimony Trioxide (Sb2O3) 1309-64-4PBT 26062-94-2CoatingAcrylised oligomerproprietary data2-ethylanthraquinone84-51-5Pentaaerythritol acrylate 4986-89-40Glycerol, propoxylated, esters with acrylic acid 52408-84-1(2,2-bis(acryloyloxymethyl)butyl acrylate 15625-89-52-hydroxyethyl methacrylate868-77-9 EpoxyacrylateSilicon Dioxide (SiO2) 112945-52-5DBCAluminum Trioxide (Al2O3) 1344-28-1 Copper (Cu) 7440-50-8Die Silicon (Si) 7440-21-3Die Attach SolderDimethyl phthalate131-11-3Amines 61788-95-2Isotridecan-1-ol 27458-92-0 Silver (Ag) 7440-22-4Tin (Sn) 7440-31-5Glue2,3-epoxypropyl-trimethoxysilan 2530-83-8 Miscellaneous trade secretSilica Crystalline (SiO2) 14808-60-7 InterconnectZinc Monoxide (ZnO) 1314-13-2 Aluminum (Al) 7429-90-5PlatingTerminal Nickel (Ni) 7440-02-0Phosphorus (P) 7723-14-0 ThermistorCopper chromite black spinel 68186-91-4Titanium Dioxide (TiO2) 13463-67-7Boron Trioxide (B2O3) 1303-86-2Lead Oxide (PbO) 1317-36-8Silica Amorphous (SiO2) 7631-86-9Misc.Palladium (Pd) 7440-05-3Barium Monoxide (BaO) 1304-28-5Ruthenium Oxide (RuO2) 12036-10-1Cobalt Oxide (Co3O4) 1308-06-1Manganese Tetraoxide (Mn3O4) 1317-35-7Wire Bond - AlTOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. 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