ࡱ;  A\pwwwadmin Ba==h\:#8X@"1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1 Arial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)                + ) , *     +    () *8  *  (8/   ()  (  (                  +    +    +  +  +  +     * `*  `  `` f*  f  f` f* *     *       `f* ff* fa* a* * *    (    (              !+   *!  (!/       (       + * *     *  (      (   !+  !  !+  !  ! `NXH020U90MNF2PTGZR3 A@@    ;7o[۶Ƶ 9/19/2024 Base Part NXH020U90MNF2HFPb-freeOrderable PartNXH020U90MNF2PTGTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightCapacitors Ceramic Titanium (Ti) 7440-32-6Tin (Sn) 7440-31-5 Oxygen (O2) 7782-44-7 Barium (Ba) 7440-39-3 Nickel (Ni) 7440-02-0 Copper (Cu) 7440-50-8CaseFiber Glass (SiO2) 65997-17-3Poly(ButyleneTerephthalate) 30965-26-5Antimony Trioxide (Sb2O3) 1309-64-4PBT 26062-94-2Carbonic Dichloride 94334-64-2DBCAluminum Trioxide (Al2O3) 1344-28-1DieSilicon Carbide409-21-2Glue2,3-epoxypropyl-trimethoxysilan 2530-83-8 Miscellaneous trade secretSilica Crystalline (SiO2) 14808-60-7 Interconnect$Distillate (petroleum), Hydrotreated 64742-47-8 Aluminum (Al) 7429-90-5Protective Coating*Poly(dimethylsiloxane), hydroxy terminated 70131-67-8 Ethylbenzene100-41-4 Filler (SiO2) 68909-20-6Misc.proprietary dataXylene 1330-20-7Terminal Silicon (Si) 7440-21-3Phosphorus (P) 7723-14-0 ThermistorNickel Oxide (NiO) 1313-99-1 Gold (Au) 7440-57-5 Iron (Fe) 7439-89-6Lead Oxide (PbO) 1317-36-8Cobalt Oxide (Co3O4) 1308-06-1Manganese Tetraoxide (Mn3O4) 1317-35-7Potassium Monoxide (K2O) 12136-45-7Wire Bond - AlTOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areexempted with the RoHS exemption 7(a), 7(c)and 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDFb p^X|c \}`   8#*  dMbP?_*+%"d,,??U} @} 9 } 2} }  8      [ NNN P \+ / / Q fg h ijףp=_@ ]    S ^@ g@  TzG0@ _>  TQ? _>  Tףp= W4@ _>  Tq= ףH@ _>  T(\#@ `?   TQ@ ^ @@   T>@ _>   T<@ _>  ! T @ _> " # T<@ `? $ %T%@ ^&@J@ ' (TD@ _>  T? `?  TM@ a)G`r@ * +TY@ ^,@33333@ - .T$@ _> / 0T$@ `? 1 2TT@ ^3@ףp= i@ 4 5T$@ `? 6 7TV@ ^8@@ 9 :TI@ _> ; <T$@ _> = >T3@ _> ? @T? `? A BT4@ ^C@@ D ETHzG? _>  T? _>  TQX@D l,BFFN<<<<<N<<<<N<<NN<<N<N<<<<N< !"#$%&'()*+,-./01234567 `? F G T? !^H!@*@ ! !!T? "_> "I "J"T333333? #_> # #!#T{Gz? $_> $ $$TY7@ %_> %K %L%T{Gz? &_> &M &N&T9@ '_> 'O 'P'TQ6@ (_> (Q (R(T333333? )_> )S )T)T333333? *_> *U *V*T ףp= ? +_> + ++T&@ ,`? ,1 ,2,TQ+@ -aW-GM@ -6 -7-TY@ .bY.!ףp=_@ .!!U/c/V0c0V1c1V2c2V3c3V4c4V5c5V6dIIIWP7e:3/pub/Collateral/BRD8022-D.PDFBg7YYYZ4<N<<<<<<<<<<<N0T<(  ~  <NUP@5%   ]4@   < Halogen Free< ~~  <@j-            !,!,!,!,--------.677 Root EntryWorkbook.