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УА УА УА УА УА УА `Е/NOIX5SE5000B-LTIМыZЁRЁ3 Ё┐БA└@@ё  ўо  ;1№ `U├█╢╣╩╙╞╡ 9/19/2024 Base PartXGS5000HFPb-freeOrderable PartNOIX5SE5000B-LTITotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightDieMisc.proprietary data Silicon (Si) 7440-21-3 Aluminum (Al) 7429-90-5Die Attach Epoxy(2,2-bis(acryloyloxymethyl)butyl acrylate 15625-89-5Imidazole Addition 68490-66-4Epoxy Phenol Novolak Resin 28064-14-4 Silica (SiO2) 14464-46-1 Imaging Lens Sulfur (S) 7704-34-9Titanium Dioxide (TiO2) 13463-67-7Sodium Monoxide (Na2O) 1313-59-3Boron Trioxide (B2O3) 1303-86-2Zinc Monoxide (ZnO) 1314-13-2Aluminum Trioxide (Al2O3) 1344-28-1Potassium Monoxide (K2O) 12136-45-7Silica Crystalline (SiO2) 14808-60-7 Lid Attach Epoxy resinAdeka Optomer SP 150 125054-47-9PhotoinitiatorSilica Amorphous (SiO2) 7631-86-9Mold Compound-BlackPhenolic ResinOxirane 39817-09-91,4-Bis(2,3-epoxypropoxy)butane 2425-79-8Carbon Black (C) 1333-86-4Fused Silica (SiO2) 60676-86-0 SubstrateFiber Glass (SiO2) 65997-17-3Inorganic filler5Inorganic Filler of Solder Mask_Talc (Mg3Si4O10(OH)2) 14807-96-6Acetophenone Derivative'2,4-Diethyl-9H-thioxanthen-9-one (DETX) 82799-44-8Solvent Naphtha (Solvent oil) 64742-94-5 Copper (Cu) 7440-50-8Barium Sulfate (BaSO4) 7727-43-7Wire Bond - Au Gold (Au) 7440-57-5TOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. 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