╨╧рб▒с;■  ■   ■                                                                                                                                                                                                                                                                                                                                                                                                                                                    ╙╠Aс░┴т\pwwwadmin B░a=Ьп╝=h\:╛#8X@Н"╖┌1╚ РArial1╚ РArial1╚ РArial1╚ РArial1 ╝Arial1╚ ╝Arial1а ╝Arial1а РArial1┤ РArial1М РArial1а РArial1а ╝Arial1╚ РArial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)рї  └ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ р └ р+ї  °└ р)ї  °└ р,ї  °└ р*ї  °└ р ї  °└ р  р + р  р () р*8 р└ р* р (8/ р  () р (└ р (└ р ╕ р ╕└ р ╕ р ╕ р ╕ р ╕└ р ╕ р ╕ р ╕+ р ╕└ р ╕+ р ╕└ р ╕+ р ╕+ р ╕+ р ╕+ р ╕ р ╕ р╕* р╕`* р ╕`└ р ╕``└ р╕f* р ╕f└ р ╕f`└ р╕f* р╕* р ╕└ р ╕└ р╕* р ╕└ р ╕└ р ╕└ р╕`f* р╕ff* р╕fa* р╕a* р╕* р╕* р ╕└ р (╕└ р ╕└ р (╕└ р ╕└ р ╕└ р ╕ р ╕└ р ╕ р ╕  р ╕!+ р ╕  р*╕! р (╕!/ р ╕ └ р ╕ └ р ╕ └ р (╕ └ р ╕ └ р ╕ └ р ╕ р ╕+ р*╕ р╕* р ╕└ р ╕└ р╕* р (╕└ р ╕└ р ╕└ р (╕ └ р ╕!+ р ╕!└ р ╕!+ р ╕! р ╕ ! УА УА УА УА УА УА `Е|LC898130DPNXHTBGМыZЁRЁ3 Ё┐БA└@@ё  ўо  ;№Ц.(├█╢╣╩╙╞╡ 9/19/2024 Base Part LC898130DPHFPb-freeOrderable PartLC898130DPNXHTBGTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightBackside Protection Film Epoxy resinproprietary dataSilicaAcrylic CopolymerOther Additive AgentsCarbon Black (C) 1333-86-4Die Silicon (Si) 7440-21-3Protection coat PolyimideRDL Titanium (Ti) 7440-32-6 Copper (Cu) 7440-50-8 Solder Ball Silver (Ag) 7440-22-4Tin (Sn) 7440-31-5TOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDF *╝ mк·&vМ▄ ╗ ╠┴   d№йё╥MbP?_*+ВА% Б┴ГДб"d,,р?р?U} @} 9 } а} р} ╤                                ¤ [╛ NNN¤ P¤ \+¤ /¤ /¤ Q¤ fg¤ h¤ ij╣НЁш@¤ ] ¤  ¤  ¤  ¤ S ¤ ^@фГЮ═к╧═?¤ ¤ TА1@╛ _>¤ ¤ T└K@╛ _>¤ ¤ T9@╛ _>¤ ¤ Tр?╛ `?¤ ¤ T°?¤ a G╠]K╚╜ @¤ ¤  TY@¤ a GК░сщХ▓╝?¤ ¤  TY@¤ ^ @ЗзW╩2─р?¤ ¤  Tр?╛ `?¤ ¤  TрX@¤ ^  @ р-Ра°┴?¤ !¤ " T@╛ _>¤ #¤ $TрW@╛ `?¤ ¤ Tр?¤ b&!╣НЁш@╛ !!UcVcVcVcVcVcVcV╛dIIIWPe:3/pub/Collateral/BRD8022-D.PDFBg╛YYYZ╫8bЇ,BFFN<<<<NNN<N<<0ь╬ЁTЁЁ<Ё( Ё   ЁЁ~в Ё г Ё<А╕NUЕЗБP┐└@╦5%╬ ┐ Ё  Ё]4@ ь Ё╢ < Halogen Free< ь~Ё~в Ё г Ё<А<╛R└ЕЗБP┐└@╦5%╬ ┐ Ё  Ё]4@ ь Ё╢<Lead Free and ROHS Compliant<   >╢@х╩                                                                                                                                                                                                                                                                                                                                                Root Entry        ■   Workbook            ╗                          ■   ■   ■