╨╧рб▒с;■  ■   ■                                                                                                                                                                                                                                                                                                                                                                                                                                                    ╙╠Aс░┴т\pwwwadmin B░a=Ьп╝=h\:╛#8X@Н"╖┌1╚ РArial1╚ РArial1╚ РArial1╚ РArial1 ╝Arial1╚ ╝Arial1а ╝Arial1а РArial1┤ РArial1М РArial1а РArial1а ╝Arial1╚ РArial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)рї  └ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ р └ р+ї  °└ р)ї  °└ р,ї  °└ р*ї  °└ р ї  °└ р  р + р  р () р*8 р└ р* р (8/ р  () р (└ р (└ р ╕ р ╕└ р ╕ р ╕ р ╕ р ╕└ р ╕ р ╕ р ╕+ р ╕└ р ╕+ р ╕└ р ╕+ р ╕+ р ╕+ р ╕+ р ╕ р ╕ р╕* р╕`* р╕`f* р╕ff* р╕fa* р╕a* р╕* р╕* р ╕└ р ╕`└ р ╕``└ р╕f* р ╕f└ р ╕f`└ р╕f* р╕* р ╕└ р ╕└ р╕* р ╕└ р ╕└ р ╕└ р (╕└ р ╕└ р (╕└ р ╕└ р ╕└ р ╕ р ╕└ р ╕ р ╕  р ╕!+ р ╕  р*╕! р (╕!/ р ╕ └ р ╕ └ р ╕ └ р (╕ └ р ╕ └ р ╕ └ р ╕ р ╕+ р*╕ р╕* р╕* р ╕└ р ╕└ р (╕└ р ╕└ р ╕└ р (╕ └ р ╕!+ р ╕!└ р ╕!+ р ╕! р ╕ ! УА УА УА УА УА УА `ЕFAR0830CSSH11SMKA1-CPМыZЁRЁ3 Ё┐БA└@@ё  ўо  ;№T0/├█╢╣╩╙╞╡ 9/19/2024 Base PartAR0830HFPb-freeOrderable PartAR0830CSSH11SMKA1-CPTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightDie Silicon (Si) 7440-21-3Glass Attach EpoxySilicone polymerproprietary dataGlass EncapsulationSilicon Dioxide 7631-86-9 Solder Ball Silver (Ag) 7440-22-4Tin (Sn) 7440-31-5 Copper (Cu) 7440-50-8 Solder Mask Polymer ResinPentaerythritol triacrylate 3524-68-3Epoxy Phenol Novolak Resin 28064-14-43-Methoxy-1-butanol 2517-43-3$ Bisphenol A_Epichlorohydrin Polymer 25068-38-6 1-Methoxy-2-propyl acetate (MPA)108-65-6Silica Crystalline (SiO2) 14808-60-7TOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDF 2└ !mЪц#oМ╪6В ╗ ╠┴   d№йё╥MbP?_*+ВА% Б┴ГДб"d,,р?р?U} @} 9 } [} р} ╤                                 ¤ [╛ NNN¤ P¤ \+¤ /¤ /¤ Q¤ fg¤ h¤ ijуеЫ─ АB@¤ ] ¤  ¤  ¤  ¤ S ¤ ^:PНЧn!@¤ ¤ TY@¤ ^:дp= ╫гр?¤ ¤ TY@¤ ^:F╢є¤╘X8@¤ ¤ TY@¤ _GЄ╥MbXє?¤ ¤ T@╛ `E¤ ¤ T X@╛ aF¤ ¤  Tр?¤ _ G'1мZ@¤ ¤  T.@╛ `E¤  ¤ ! T$@╛ `E¤ "¤ # T$@╛ `E¤ $¤ % T.@╛ `E¤ &¤ 'T9@╛ `E¤ (¤ )T.@╛ aF¤ *¤ +T$@¤ b-!уеЫ─ АB@╛ !!UcVcVcVcVcVcVcV╛dIIIWPe:3/pub/Collateral/BRD8022-D.PDFBg╛YYYZ╫:▓,BFFNNNN<<N<<<<<<0ь╬ЁTЁЁ<Ё( Ё   ЁЁ~в Ё г Ё<А╕NUЕЗБP┐└@╦5%╬ ┐ Ё  Ё]4@ ь Ё╢ < Halogen Free< ь~Ё~в Ё г Ё<А<╛R└ЕЗБP┐└@╦5%╬ ┐ Ё  Ё]4@ ь Ё╢<Lead Free and ROHS Compliant<   >╢@х╩                                                  Root Entry        ■   Workbook            ╫!                         ■   ■   ■