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УА УА УА УА УА УА `ЕgAR0147ATSC00XUEA5-DRBRМыZЁRЁ3 Ё┐БA└@@ё  ўо  ;9№; va├█╢╣╩╙╞╡ 9/19/2024 Base PartAR0147ATHFPb-freeOrderable PartAR0147ATSC00XUEA5-DRBRTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightDieMisc.proprietary data Silicon (Si) 7440-21-3 Aluminum (Al) 7429-90-5 Die AttachBismaleimide Monomer+POLY(ETHYLENE GLYCOL) PHENYL ETHER ACRYLATE 56641-05-5B2,2-Bis(4-hydroxyphenyl)propane-epichlorohydrin copolymer acrylate 55818-57-0-Bis(4-tert-butylcyclohexyl) peroxydicarbonate 15520-11-3+2,2-dimethyl-1,3-propanediyl dimethacrylate 1985-51-92-phenoxy ethyl acrylate 48145-04-6$ Bisphenol A_Epichlorohydrin Polymer 25068-38-6Other Additive AgentsFormaldehyde Polymer 9003-36-5EpoxyImidazole Addition 68490-66-4Zirconium Dioxide (ZrO2) 1314-23-4Silica Amorphous (SiO2) 7631-86-9 Imaging LensTitanium Dioxide (TiO2) 13463-67-7Sodium Monoxide (Na2O) 1313-59-3Boron Trioxide (B2O3) 1303-86-2Zinc Monoxide (ZnO) 1314-13-2Aluminum Trioxide (Al2O3) 1344-28-1Potassium Monoxide (K2O) 12136-45-7Silica Crystalline (SiO2) 14808-60-7 Mold Compound!Hexahydromethylphthalic anhydride 25550-51-0$1,6-Bis(2,3-epoxypropoxy)naphthalene 27610-48-6Fused Silica (SiO2) 60676-86-0 Solder Ball Silver (Ag) 7440-22-4Tin (Sn) 7440-31-5 Copper (Cu) 7440-50-8 Solder Mask Epoxy resinTalc 14807-96-6Carbon Black (C) 1333-86-4Barium Sulfate (BaSO4) 7727-43-7Substrate Copper FoilSubstrate - Core MaterialFiber Glass (SiO2) 65997-17-3Substrate Plating-Au Gold (Au) 7440-57-5Substrate Plating-CuSubstrate Plating-Ni Nickel (Ni) 7440-02-0Wire Bond - AuTOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. 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