╨╧рб▒с;■  ■   ■                                                                                                                                                                                                                                                                                                                                                                                                                                                    ╙╠Aс░┴т\pwwwadmin B░a=Ьп╝=h\:╛#8X@Н"╖┌1╚ РArial1╚ РArial1╚ РArial1╚ РArial1 ╝Arial1╚ ╝Arial1а ╝Arial1а РArial1┤ РArial1М РArial1а РArial1а ╝Arial1╚ РArial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)рї  └ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ р └ р+ї  °└ р)ї  °└ р,ї  °└ р*ї  °└ р ї  °└ р  р + р  р () р*8 р└ р* р (8/ р  () р (└ р (└ р ╕ р ╕└ р ╕ р ╕ р ╕ р ╕└ р ╕ р ╕ р ╕+ р ╕└ р ╕+ р ╕└ р ╕+ р ╕+ р ╕+ р ╕+ р ╕ р ╕ р╕* р╕`* р╕`f* р╕ff* р╕fa* р╕a* р╕* р╕* р ╕└ р ╕`└ р ╕``└ р╕f* р ╕f└ р ╕f`└ р╕f* р╕* р ╕└ р ╕└ р╕* р ╕└ р ╕└ р ╕└ р (╕└ р ╕└ р (╕└ р ╕└ р ╕└ р ╕ р ╕└ р ╕ р ╕  р ╕!+ р ╕  р*╕! р (╕!/ р ╕ └ р ╕ └ р ╕ └ р (╕ └ р ╕ └ р ╕ └ р ╕ р ╕+ р*╕ р╕* р╕* р ╕└ р ╕└ р (╕└ р ╕└ р ╕└ р (╕ └ р ╕!+ р ╕!└ р ╕!+ р ╕! р ╕ ! УА УА УА УА УА УА `Е, 74VHC138MTCXМыZЁRЁ3 Ё┐БA└@@ё  ўо  ;№:;4├█╢╣╩╙╞╡ 9/19/2024 Base Part74VHC138HFPb-freeOrderable Part 74VHC138MTCXTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightDie Silicon (Si) 7440-21-3 Die Attach Epoxy resinproprietary data Silver (Ag) 7440-22-4Formaldehyde Polymer 9003-36-5 Lead Frame Zinc (Zn) 7440-66-6 Iron (Fe) 7439-89-6 Copper (Cu) 7440-50-8Phosphorus (P) 7723-14-0Mold Compound-BlackPhenolic ResinSilica Amorphous (SiO2) 7631-86-9Carbon Black (C) 1333-86-4Fused Silica (SiO2) 60676-86-0PlatingPalladium (Pd) 7440-05-3 Nickel (Ni) 7440-02-0 Gold (Au) 7440-57-5 Wire BondTOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDF :╕ gМрWk┐∙M_│ ╗ ╠┴  д  d№йё╥MbP?_*+ВА% Б┴ГДб"d,,р?р?U} @} 9 } ·} р} ╤                                       ¤ [╛ NNN¤ P¤ \+¤ /¤ /¤ Q¤ fg¤ h¤ ij= ╫гpL@¤ ] ¤  ¤  ¤  ¤ S ¤ ^:оGсzоч?¤ ¤ TY@¤ _G/▌$Б╡?¤ ¤ T$@╛ `E¤ ¤ TT@╛ aF¤ ¤ T$@¤ _Gю|?5^:7@¤ ¤ T╕ЕыQ╕╛?╛ `E¤ ¤  T═╠╠╠╠╠@╛ `E¤ ¤  T`X@╛ aF¤ ¤   T╕ЕыQ╕Ю?¤ _! G═╠╠╠╠╠?@¤ ¤  T@╛ `E¤ "¤  T@╛ `E¤ #¤ $T@╛ `E¤ %¤ &Tр?╛ aF¤ '¤ (TАT@¤ _)GbX9┤╚╞?¤ *¤ +T T╞┐╧x@╛ `E¤ ,¤ -Tу6└[рW@╛ aF¤ .¤ /TH0Б[ў·?¤ _0GЪЩЩЩЩЩ╔?¤ *¤ +TЁ?╛ aF¤ ¤ T└X@¤ b2!= ╫гpL@╛ !!UcVcVcVcVcVcVcV╛dIIIWPe:3/pub/Collateral/BRD8022-D.PDFBg╛YYYZ╫DT l,BFFNN<<N<<<N<<<<N<<N<0ь╬ЁTЁЁ<Ё( Ё   ЁЁ~в Ё г Ё<А╕NUЕЗБP┐└@╦5%╬ ┐ Ё  Ё]4@ ь Ё╢ < Halogen Free< ь~Ё~в Ё г Ё<А<╛R└ЕЗБP┐└@╦5%╬ ┐ Ё  Ё]4@ ь Ё╢<Lead Free and ROHS Compliant<   >╢@хъ                                                                                                                                Root Entry        ■   Workbook            Й#                         ■   ■   ■