╨╧рб▒с;■  ■   ■                                                                                                                                                                                                                                                                                                                                                                                                                                                    ╙╠Aс░┴т\pwwwadmin B░a=Ьп╝=h\:╛#8X@Н"╖┌1╚ РArial1╚ РArial1╚ РArial1╚ РArial1 ╝Arial1╚ ╝Arial1а ╝Arial1а РArial1┤ РArial1М РArial1а РArial1а ╝Arial1╚ РArial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)рї  └ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ р └ р+ї  °└ р)ї  °└ р,ї  °└ р*ї  °└ р ї  °└ р  р + р  р () р*8 р└ р* р (8/ р  () р (└ р (└ р ╕ р ╕└ р ╕ р ╕ р ╕ р ╕└ р ╕ р ╕ р ╕+ р ╕└ р ╕+ р ╕└ р ╕+ р ╕+ р ╕+ р ╕+ р ╕ р ╕ р╕* р╕`* р ╕`└ р ╕``└ р╕f* р ╕f`└ р╕f* р╕* р ╕└ р ╕└ р╕* р ╕└ р ╕└ р ╕f└ р ╕└ р╕`f* р╕ff* р╕fa* р╕a* р╕* р╕* р ╕└ р (╕└ р ╕└ р (╕└ р ╕└ р ╕└ р ╕ р ╕└ р ╕ р ╕  р ╕!+ р ╕  р*╕! р (╕!/ р ╕ └ р ╕ └ р ╕ └ р (╕ └ р ╕ └ р ╕ └ р ╕ р ╕+ р*╕ р╕* р ╕└ р ╕└ р╕* р (╕└ р ╕└ р ╕└ р (╕ └ р ╕!+ р ╕!└ р ╕!+ р ╕! р ╕ ! УА УА УА УА УА УА `Е╒6N137SDMМыZЁRЁ3 Ё┐БA└@@ё  ўо  ; №▀=:├█╢╣╩╙╞╡ 9/19/2024 Base Part6N137MPb-freeOrderable Part6N137SDMTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. Weight Coupling GelDimethyl Cyclosiloxanes 69430-24-6$Trimethoxy(methyl)silane (C4H12O3Si) 1185-55-3DieGallium Arsenide (AsGa) 1303-00-0 Silicon (Si) 7440-21-3 Die Attach Silver (Ag) 7440-22-4Phenolic Resin-2 54208-63-8 Lead Frame Zinc (Zn) 7440-66-6 Iron (Fe) 7439-89-6 Copper (Cu) 7440-50-8Phosphorus (P) 7723-14-0Mold Compound-White Epoxy resinproprietary data Phenol ResinTitanium Dioxide (TiO2) 13463-67-7'Brominated Bisphenol A Diglycidyl Ether 40039-93-8Antimony Trioxide (Sb2O3) 1309-64-4Fused Silica (SiO2) 60676-86-0PlatingTin (Sn) 7440-31-5Wire Bond - Au Gold (Au) 7440-57-5TOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDF B┤ pЮЎ%}Рш b╡ l ╗ ╠┴ !5 ў  d№йё╥MbP?_*+ВА% Б┴ГДб"d,,р?р?U} @} 9 } 1} р} ╤ !                                     ¤ [╛ NNN¤ P¤ \+¤ //¤ Q¤ fg¤ h¤ ij├ї(\П@¤ ]¤  ¤  ¤  ¤ S ¤ ^ >═╠╠╠╠╠▄?¤ ¤ T$@╛ _=¤ ¤ TАV@¤ ^>%БХC @¤ ¤ Tаl╩▐@╛ _=¤ ¤ TkЪwЬв?W@¤ ^>кё╥Mb╨?¤ ¤ TaTR'а╣R@╛ _=¤ ¤  T}о╢b9@¤ ^ >╦бE╢є\@¤ ¤  T▀зк╨@,ф?╛ `@¤ ¤  TтvhXМ║╛?╛ `@¤ ¤   T\цtYLl@╛ `@¤ !¤ " T-▓Эяз:X@╛ _=¤ #¤ $T сSе╥ЇЮ?¤ ^%>ЪЩЩЩЩyw@¤ &¤ 'T+@╛ `@¤ (¤ 'T@╛ `@¤ )¤ *T9@╛ `@¤ +¤ ,T@╛ `@¤ -¤ .T@╛ _=¤ /¤ 0TI@¤ a1G ╫гp= @¤ 2¤ 3TY@¤ a4G@¤ 5¤ 6TY@¤ b8!├ї(\П@╛ !!UcVcVcVcVcVcVcV╛dIIIW╫D8 l,>FFN<N<N<N<<<<N<<<<<NN0  P e:3/pub/Collateral/BRD8022-D.PDFBg╛ YYYZ╫zь╬Ё╬ЁЁ╢Ё( Ё   ЁЁ~в Ё г Ё<А<╛R└ЕЗБP┐└@╦5%╬ ┐ Ё  Ё]4@ ь Ё╢<Lead Free and ROHS Compliant<  >╢@х !                                                                                             Root Entry        ■   Workbook            н#                         ■   ■   ■